Overcome the Limitations of Performance Parameters of On-Chip Antennas Based on Metasurface and Coupled Feeding Approaches for Applications in System-on-Chip for THz Integrated-Circuits

Alibakhshikenari, Mohammad; Virdee, Bal S.; Hwang See, Chan; Abd-Alhameed, Raed; Falcone, Francisco; Limiti, Ernesto

Abstract

This paper proposes a new solution to improve the performance parameters of on-chip antenna designs on standard CMOS silicon technology. The proposed method is based on applying the metasurface technique and exciting the radiating elements through coupled feed mechanism. The on-chip antenna is constructed from three layers comprising silicon-ground-silicon layers, so that the ground plane has sandwiched between two silicon layers. The silicon and ground-plane layers have thicknesses of 20μm and 5μm, respectively. The 3×3 array consisting of the asterisk-shaped radiating elements has implemented on the top silicon layer by applying the metasurface approach. Three slot lines in the ground-plane are modelled and located directly under
the radiating elements. The radiating elements are excited through the slot-lines using an open-circuited microstrip-line constructed on the bottom silicon layer. The proposed method to excite the structure is based on the coupled feeding mechanism. In addition, by the proposed feeding method the on-chip antenna configuration supresses the substrate losses and surface-waves. The antenna exhibits a large impedance bandwidth of 60GHz from 0.5THz to 0.56THz with an average radiation gain and efficiency of 4.58dBi and 25.37%, respectively. The proposed structure has compact dimensions of 200×200×45μm3. The results shows that, the proposed technique is therefore suitable for on-chip antennas for applications

Citation

Alibakhshikenari, M., Virdee, B. S., Hwang See, C., Abd-Alhameed, R., Falcone, F., & Limiti, E. (2019, December). Overcome the Limitations of Performance Parameters of On-Chip Antennas Based on Metasurface and Coupled Feeding Approaches for Applications in System-on-Chip for THz Integrated-Circuits. Presented at 2019 IEEE Asia-Pacific Microwave Conference (APMC), Singapore

• Presentation Conference Type: Conference Paper (published)
• Conference Name: 2019 IEEE Asia-Pacific Microwave Conference (APMC)
• Start Date: Dec 10, 2019
• End Date: Dec 13, 2019
• Acceptance Date: Aug 30, 2019
• Online Publication Date: Mar 19, 2020
• Publication Date: Mar 19, 2020
• Deposit Date: Sep 24, 2019
• Publicly Available Date: Sep 25, 2019
• Publisher: Institute of Electrical and Electronics Engineers
• ISBN: 978-1-7281-3517-5
• DOI: https://doi.org/10.1109/APMC46564.2019.9038524
• Keywords: On-chip antennas, metasurface, coupled feeding mechanism, terahertz (THz) systems-on-chip applications, CMOS silicon technology, THz integrated circuits
• Public URL: http://researchrepository.napier.ac.uk/Output/2161139
• Publisher URL: http://web.apmc2019.org/client/sites/view/SP8f993