S. Webster
PVDF sensors with low-temperature bonding techniques
Webster, S.; Binnie, T.D.
Authors
T.D. Binnie
Abstract
The performances of poly-vinylidene fluoride (PVDF) thin-film infrared sensors with alternative bonding methods are presented in comparison with a more established method. A responsivity of 25 V (W cm−2)−1 is achieved using a commercially available acrylic adhesive. This method removes the requirement of raised temperature treatment of the PVDF thin-film material, which is prone to thermal damage at relatively low temperatures.
Journal Article Type | Article |
---|---|
Acceptance Date | Mar 13, 1995 |
Publication Date | 1995-06 |
Deposit Date | Dec 9, 2019 |
Journal | Sensors and Actuators A: Physical |
Print ISSN | 0924-4247 |
Publisher | Elsevier |
Peer Reviewed | Peer Reviewed |
Volume | 49 |
Issue | 1-2 |
Pages | 61-65 |
DOI | https://doi.org/10.1016/0924-4247%2895%2901010-x |
Keywords | Infrared sensors, Low-temperature bonding, Poly-vinylidene fluoride, Thin films |
Public URL | http://researchrepository.napier.ac.uk/Output/950809 |
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