PVDF sensors with low-temperature bonding techniques

Webster, S.; Binnie, T.D.

Abstract

The performances of poly-vinylidene fluoride (PVDF) thin-film infrared sensors with alternative bonding methods are presented in comparison with a more established method. A responsivity of 25 V (W cm−2)−1 is achieved using a commercially available acrylic adhesive. This method removes the requirement of raised temperature treatment of the PVDF thin-film material, which is prone to thermal damage at relatively low temperatures.

Citation

Webster, S., & Binnie, T. (1995). PVDF sensors with low-temperature bonding techniques. Sensors and Actuators A: Physical, 49(1-2), 61-65. https://doi.org/10.1016/0924-4247%2895%2901010-x

• Journal Article Type: Article
• Acceptance Date: Mar 13, 1995
• Publication Date: 1995-06
• Deposit Date: Dec 9, 2019
• Journal: Sensors and Actuators A: Physical
• Print ISSN: 0924-4247
• Publisher: Elsevier
• Peer Reviewed: Peer Reviewed
• Volume: 49
• Issue: 1-2
• Pages: 61-65
• DOI: https://doi.org/10.1016/0924-4247%2895%2901010-x
• Keywords: Infrared sensors, Low-temperature bonding, Poly-vinylidene fluoride, Thin films
• Public URL: http://researchrepository.napier.ac.uk/Output/950809