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Flexible RFID Patch for Food Spoilage Monitoring

Yuan, Mengyao; Ghannam, Rami; Karadimas, Petros; Heidari, Hadi

Authors

Mengyao Yuan

Rami Ghannam

Hadi Heidari



Abstract

When food is reversed under an inappropriate situation, for example inadequate temperature, foodstuff would turn rotten as a result of the rapid breed of food spoilage bacteria under warm and wet circumstances where bacteria can be easily generated, the consequences can be worse if human beings eat those degenerative comestible, we might get bromatoxism. This paper focuses on the designing and simulation of a wearable radio frequency identification (RFID) patch for food spoilage monitoring with smart packaging that can be recognized and read temperature information by device supporting near field communication (NFC) technology through an attached circular antenna. More precisely, this patch can be read under a designed high frequency of 13.56MHz, and data is transmitted from the chip MLX90129 with its internal sensor that sends the temperature to the reader module.

Citation

Yuan, M., Ghannam, R., Karadimas, P., & Heidari, H. (2018, October). Flexible RFID Patch for Food Spoilage Monitoring. Presented at 2018 IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia), Chengdu, China

Presentation Conference Type Conference Paper (Published)
Conference Name 2018 IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia)
Start Date Oct 26, 2018
End Date Oct 30, 2018
Online Publication Date Jan 3, 2019
Publication Date 2018
Deposit Date Dec 28, 2022
Publisher Institute of Electrical and Electronics Engineers
Pages 68-71
Series ISSN 2159-2160
Book Title 2018 IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia)
DOI https://doi.org/10.1109/primeasia.2018.8598134
Keywords Temperature Sensing, RFID, Smart Packaging, Food Monitoring
Public URL http://researchrepository.napier.ac.uk/Output/2994263